meta data for this page
Differences
This shows you the differences between two versions of the page.
Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
groups:mg:project_ptb-cavity:vacuum:bake_out [2017/05/17 10:04] – ssauer | groups:mg:project_ptb-cavity:vacuum:bake_out [2024/03/20 09:36] (current) – Admin: Syntax-Update (Migration from deprecated "fontcolor" plugin to "color" plugin) klaus | ||
---|---|---|---|
Line 1: | Line 1: | ||
- | ====== Bake out ====== | + | ====== Bake out list ====== |
- | * We use the temperature monitoring design, made by E. Wodey, for the out of loop measurements during the out baking. | ||
- | * Talk by E. Wodey for the explanation of the monitoring system:{{ : | ||
- | * Box-design made by S. Sauer: {{: | ||
- | |||
- | |||
- | ==== Bake out list ==== | ||
^ Item ^ Material | ^ Item ^ Material | ||
Line 12: | Line 6: | ||
| Mounting for the spacer | | Mounting for the spacer | ||
| Zerodur rods | Zerodur | | Zerodur rods | Zerodur | ||
- | | Heat shields | + | | Heat shields |
- | | Screws from the mounting and hield shield | + | |
| Window holder | | Window holder | ||
| Vacuum chamber | | Vacuum chamber | ||
Line 19: | Line 12: | ||
| Glas balls | Borosilikatglas | | Glas balls | Borosilikatglas | ||
| IGP | | 350 | | | | IGP | | 350 | | | ||
- | | Sub-D Socket | ||
- | | CF-Kreuz | ||
| Lead wire | Lead | 327 | | | | Lead wire | Lead | 327 | | | ||
+ | | Teflon rings (Windows) | ||
| NTC Sensors | | NTC Sensors | ||
| Angle valve | | < = 300 | | | | Angle valve | | < = 300 | | | ||
- | | Capton wires | Kupferdraht versilbert\\ Kaptonband-isoliert | ||
| Viton balls | Viton | 280 | Wikipedia | | Viton balls | Viton | 280 | Wikipedia | ||
- | | Sub-D Kabel 37FXRR-500 | + | | Sub-D Kabel 37FXRR-500 |
| Vacuum pressure sensor | | Vacuum pressure sensor | ||
| Gate valve | | Gate valve | ||
+ | | Sub-D Socket | ||
| Sub-D Feedthrough | | Sub-D Feedthrough | ||
| Crimp pins | Cu vergoldet | | Crimp pins | Cu vergoldet | ||
+ | | Capton wires | Kupferdraht versilbert\\ Kaptonband-isoliert | ||
| IGP cable | | < 220 | | | | IGP cable | | < 220 | | | ||
| Peltier-elements | | Peltier-elements | ||
Line 38: | Line 31: | ||
| Indium foil | Indium | | Indium foil | Indium | ||
| Vacuum pressure sensor cable | | Vacuum pressure sensor cable | ||
+ | | CF-Kreuz | ||
+ | | Screws from the mounting and hield shield | ||
| ULE Spacer| | | ULE Spacer| | ||
Line 45: | Line 39: | ||
| Faraday rotator | | | | | Faraday rotator | | | | ||
| Glue from faraday rotator | | | | | Glue from faraday rotator | | | | ||
- | |||
- | ==== Bake out tips ==== | ||
- | |||
- | http:// | ||
- | |||
- | |||
- | 3.3 Baking\\ | ||
- | Early workers baked systems only to about 200C which was effective in removing weakly bound surface water and hydrocarbon molecules. It was not long before it was discovered that baking to higher temperatures was required to remove more tightly bound species and the hydrogen diffusing from the bulk, both of which had the effect of limiting the ultimate system vacuum. The effectiveness of high temperature bakes is amply demonstrated | ||
- | Santeler (1991), quotes early work by Aero Vac Corporation which gives valuable data on the effect of baking to different temperatures which is reproduced here below:\\ | ||
- | **Outgassing rates in Torr l/s cm2**\\ | ||
- | |||
- | |||
- | === BAKING TIME === | ||
- | |||
- | ^ BAKING TEMP ^ 20 hrs ^ 40 hrs ^ 100 hrs ^ 200hrs ^ | ||
- | | 150C | 6.3E-11 | 5.3E-11 | 2.8E-11 | 2.0E-11 | | ||
- | | 250C | 6.3E-12 | 5.3E-12 | 2.8E-12 | 2.0E-12 | | ||
- | | 400C | 4.0E-13 | 1.7E-13 | 1.0E-13 | 1.0E-13 | | ||
- | | 500C | 8.0E-15 | 8.0E-16 | 4.0E-17 | 8.0E-19 | | ||
- | |||
- | The data above bring home clearly the benefits of high baking temperatures and the diminishing returns from increasing baking time much beyond 20 hrs for baking temperatures up to 400C; at 500C the table shows that it is worthwhile to bake for as long as 200 hrs although one might legitimately question the unusually low value of 8.0E-19 torr l/s cm2 that is quoted. Recent work (Ishikawa, 1995; Ishikawa et al 1991; and Ishikawa and Odaka1990), confirms the values above for lower temperatures but indicates that surface treatments and raw material quality can improve these figures substantially, | ||
- | |||
- | ==== Bake out Protocol ==== | ||
- | |||